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3D Microelectronics: Self‐Assembled Multifunctional 3D Microdevices (Adv. Electron. Mater. 6/2016)
Author(s) -
Joung Daeha,
Agarwal Kriti,
Park HyeongRyeol,
Liu Chao,
Oh SangHyun,
Cho JeongHyun
Publication year - 2016
Publication title -
advanced electronic materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.25
H-Index - 56
ISSN - 2199-160X
DOI - 10.1002/aelm.201670035
Subject(s) - microelectronics , materials science , nanotechnology , semiconductor , self assembly , optoelectronics
In article number 1500459, Jeong‐Hyun Cho and co‐workers realize functionalized 3D polyhedral microelectronic devices by an evolved self‐assembly method. Their results suggest that desired metal and semiconductor patterns can be incorporated onto surfaces of 3D dielectric polyhedral microstructures. Their self‐assembly process could be applied to the development of next‐generation 3D microelectronic sensors and devices utilizing the numerous advantages of 3D configurations.