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Stress Dissipation Encoded Silk Fibroin Electrode for the Athlete‐Beneficial Silk Bioelectronics (Adv. Sci. 8/2022)
Author(s) -
Choi Woojin,
Heo Deokjae,
Kim Taeho,
Jung Sungwon,
Choi Moonhyun,
Heo Jiwoong,
Kwon JaeSung,
Kim ByeongSu,
Lee Wonhwa,
Koh WonGun,
Cho Jeong Ho,
Lee Sangmin,
Hong Jinkee
Publication year - 2022
Publication title -
advanced science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 5.388
H-Index - 100
ISSN - 2198-3844
DOI - 10.1002/advs.202270047
Subject(s) - bioelectronics , fibroin , silk , biopolymer , sericin , materials science , wearable computer , nanotechnology , toughness , composite material , polymer science , computer science , biosensor , polymer , embedded system
Wearable Bioelectronics Wearable bioelectronics pursues superior biopolymer fabric enduring mechanical stress during workouts. In article number 2105420, Sangmin Lee, Jinkee Hong, and co‐workers develop a super‐tough silk fibroin fabric band by encoding the domains for stress dissipation. Precisely crosslinked phenolic amino acid offers sufficient toughness exceeding the fitness‐originated fabric deformations. Furthermore, the proposed silk bioelectronics can assist the active workouts by relieving muscular fatigue and injuries.

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