Open AccessSwitchable Adhesion: On‐Demand Bonding and Debonding
Author(s) -
Liu Ziyang,
Yan Feng
Publication year - 2022
Publication title -
advanced science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 5.388
H-Index - 100
ISSN - 2198-3844
DOI - 10.1002/advs.202200264
Subject(s) - adhesive , materials science , electronics , adhesion , nanotechnology , computer science , soft robotics , composite material , artificial intelligence , engineering , robot , electrical engineering , layer (electronics)
Adhesives have a long and illustrious history throughout human history. The development of synthetic polymers has highly improved adhesions in terms of their strength and environmental tolerance. As soft robotics, flexible electronics, and intelligent gadgets become more prevalent, adhesives with changeable adhesion capabilities will become more necessary. These adhesives should be programmable and switchable, with the ability to respond to light, electromagnetic fields, thermal, and other stimuli. These requirements necessitate novel concepts in adhesion engineering and material science. Considerable studies have been carried out to develop a wide range of adhesives. This review focuses on stimuli‐responsive material‐based adhesives, outlining current research on switchable and controlled adhesives, including design and manufacturing techniques. Finally, the potential for smart adhesives in applications, and the development of future adhesive forms are critically suggested.