Open AccessWood‐Derived, Vertically Aligned, and Densely Interconnected 3D SiC Frameworks for Anisotropically Highly Thermoconductive Polymer Composites
Author(s) -
Zhou Xiaonan,
Xu Songsong,
Wang Zhongyu,
Hao Liucheng,
Shi Zhongqi,
Zhao Junping,
Zhang Qiaogen,
Ishizaki Kozo,
Wang Bo,
Yang Jianfeng
Publication year - 2022
Publication title -
advanced science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 5.388
H-Index - 100
ISSN - 2198-3844
DOI - 10.1002/advs.202103592
Subject(s) - materials science , composite material , microstructure , thermal conductivity , epoxy , filler (materials) , anisotropy , thermal expansion , composite number , polymer , flexural strength , thermal management of electronic devices and systems , mechanical engineering , physics , quantum mechanics , engineering
Construction of a vertically aligned and densely interconnected ordered 3D filler framework in a polymer matrix is a challenge to attain significant thermal conductivity (TC) enhancement efficiency. Fortunately, many biomaterials with unique microstructures can be found in nature. With inspiration from wood, artificial composites can be rationally designed to achieve desired properties. Herein, the authors report a facile and effective approach to fabricate anisotropic polymer composites by biotemplate ceramization technology and subsequent vacuum impregnation of epoxy resin. The hierarchical microstructure of wood is perfectly replicated in the cellular biomass derived SiC (bioSiC) framework by carbothermal reduction. Owing to the anisotropic architecture of bioSiC, the epoxy composite with vertically aligned dense SiC microchannels shows interesting properties, including a high TC (10.27 W m −1 K −1 ), a significant enhancement efficiency (259 per 1 vol% loading), an outstanding anisotropic TC ratio (5.77), an extremely low coefficient of linear thermal expansion (12.23 ppm K −1 ), a high flexural strength (222 MPa), and an excellent flame resistance. These results demonstrate that this approach is expected to open a new avenue for design and preparation of high performance thermal management materials to address the heat dissipation of modern electronics.