Open AccessMultiscale Structural Modulation of Anisotropic Graphene Framework for Polymer Composites Achieving Highly Efficient Thermal Energy Management
Author(s) -
Dai Wen,
Lv Le,
Ma Tengfei,
Wang Xiangze,
Ying Junfeng,
Yan Qingwei,
Tan Xue,
Gao Jingyao,
Xue Chen,
Yu Jinhong,
Yao Yagang,
Wei Qiuping,
Sun Rong,
Wang Yan,
Liu TeHuan,
Chen Tao,
Xiang Rong,
Jiang Nan,
Xue Qunji,
Wong ChingPing,
Maruyama Shigeo,
Lin ChengTe
Publication year - 2021
Publication title -
advanced science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 5.388
H-Index - 100
ISSN - 2198-3844
DOI - 10.1002/advs.202003734
Subject(s) - graphene , materials science , thermal conductivity , composite material , anisotropy , interfacial thermal resistance , electrical conductor , thermal , thermal transfer , polymer , thermal resistance , nanotechnology , layer (electronics) , physics , quantum mechanics , meteorology
Graphene is usually embedded into polymer matrices for the development of thermally conductive composites, preferably forming an interconnected and anisotropic framework. Currently, the directional self‐assembly of exfoliated graphene sheets is demonstrated to be the most effective way to synthesize anisotropic graphene frameworks. However, achieving a thermal conductivity enhancement (TCE) over 1500% with per 1 vol% graphene content in polymer matrices remains challenging, due to the high junction thermal resistance between the adjacent graphene sheets within the self‐assembled graphene framework. Here, a multiscale structural modulation strategy for obtaining highly ordered structure of graphene framework and simultaneously reducing the junction thermal resistance is demonstrated. The resultant anisotropic framework contributes to the polymer composites with a record‐high thermal conductivity of 56.8–62.4 W m −1 K −1 at the graphene loading of ≈13.3 vol%, giving an ultrahigh TCE per 1 vol% graphene over 2400%. Furthermore, thermal energy management applications of the composites as phase change materials for solar‐thermal energy conversion and as thermal interface materials for electronic device cooling are demonstrated. The finding provides valuable guidance for designing high‐performance thermally conductive composites and raises their possibility for practical use in thermal energy storage and thermal management of electronics.