Open AccessHigh‐Throughput Fabrication of Flexible and Transparent All‐Carbon Nanotube Electronics
Author(s) -
Chen YongYang,
Sun Yun,
Zhu QianBing,
Wang BingWei,
Yan Xin,
Qiu Song,
Li QingWen,
Hou PengXiang,
Liu Chang,
Sun DongMing,
Cheng HuiMing
Publication year - 2018
Publication title -
advanced science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 5.388
H-Index - 100
ISSN - 2198-3844
DOI - 10.1002/advs.201700965
Subject(s) - fabrication , materials science , carbon nanotube , electronics , nanotechnology , flexible electronics , thin film transistor , electronic circuit , optoelectronics , substrate (aquarium) , transistor , flexible display , throughput , voltage , computer science , electrical engineering , alternative medicine , engineering , pathology , layer (electronics) , geology , medicine , telecommunications , oceanography , wireless
This study reports a simple and effective technique for the high‐throughput fabrication of flexible all‐carbon nanotube (CNT) electronics using a photosensitive dry film instead of traditional liquid photoresists. A 10 in. sized photosensitive dry film is laminated onto a flexible substrate by a roll‐to‐roll technology, and a 5 µm pattern resolution of the resulting CNT films is achieved for the construction of flexible and transparent all‐CNT thin‐film transistors (TFTs) and integrated circuits. The fabricated TFTs exhibit a desirable electrical performance including an on–off current ratio of more than 10 5 , a carrier mobility of 33 cm 2 V −1 s −1 , and a small hysteresis. The standard deviations of on‐current and mobility are, respectively, 5% and 2% of the average value, demonstrating the excellent reproducibility and uniformity of the devices, which allows constructing a large noise margin inverter circuit with a voltage gain of 30. This study indicates that a photosensitive dry film is very promising for the low‐cost, fast, reliable, and scalable fabrication of flexible and transparent CNT‐based integrated circuits, and opens up opportunities for future high‐throughput CNT‐based printed electronics.