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Direct Fabrication of VIA Interconnects by Electrohydrodynamic Printing for Multi‐Layer 3D Flexible and Stretchable Electronics
Author(s) -
Ren Ping,
Dong Jingyan
Publication year - 2021
Publication title -
advanced materials technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.184
H-Index - 42
ISSN - 2365-709X
DOI - 10.1002/admt.202100280
Subject(s) - fabrication , materials science , stretchable electronics , flexible electronics , layer (electronics) , electronics , interconnection , printed electronics , electrical conductor , electrohydrodynamics , 3d printing , optoelectronics , bending , nanotechnology , inkwell , electrical engineering , composite material , electrode , computer science , engineering , telecommunications , medicine , chemistry , alternative medicine , pathology
Multi‐layer electrical interconnects are critical for the development of integrated soft wearable electronic systems, in which functional devices from different layers need to be connected together by vertical interconnects. In this work, electrohydrodynamic (EHD) printing technology is studied to achieve multi‐layer flexible and stretchable electronics by direct printing vertical interconnects as vertical interconnect accesses (VIAs) using a low‐melting‐point metal alloy. The EHD printed metallic vertical interconnection represents a promising way for the direct fabrication of multilayer integrated electronics with metallic conductivity and excellent flexibility and stretchability. By controlling the printing conditions, vertical interconnects that can bridge different heights can be fabricated. To achieve reliable VIA connections under bending and stretching conditions, an epoxy protective structure is printed around the VIA interconnects to form a core‐shell structure. A stable electrical response is achieved under hundreds of bending cycles and during stretching/releasing cycles in a large range of tensile strain (0–40%) for the printed conductors with VIA interconnects. A few multi‐layer devices, including a multiple layer heater, and a pressure‐based touch panel are fabricated to demonstrate the capability of the EHD printing for the direct fabrication of vertical metallic VIA interconnects for flexible and stretchable devices.