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Recent Progress on Flexible Capacitive Pressure Sensors: From Design and Materials to Applications
Author(s) -
Mishra Rishabh B.,
ElAtab Nazek,
Hussain Aftab M.,
Hussain Muhammad M.
Publication year - 2021
Publication title -
advanced materials technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.184
H-Index - 42
ISSN - 2365-709X
DOI - 10.1002/admt.202001023
Subject(s) - capacitive sensing , fabrication , microelectromechanical systems , electronics , pressure sensor , capacitance , aerospace , finite element method , nanotechnology , materials science , microelectronics , mechanical engineering , computer science , electronic engineering , engineering , electrical engineering , aerospace engineering , structural engineering , medicine , chemistry , alternative medicine , electrode , pathology
For decades, the revolution in design and fabrication methodology of flexible capacitive pressure sensors using various inorganic/organic materials has significantly enhanced the field of flexible and wearable electronics with a wide range of applications in aerospace, automobiles, marine environment, robotics, healthcare, and consumer/portable electronics. Mathematical modelling, finite element simulations, and unique fabrication strategies are utilized to fabricate diverse shapes of diaphragms, shells, and cantilevers which function in normal, touch, or double touch modes, operation principles inspired from microelectromechanical systems (MEMS) based capacitive pressure sensing techniques. The capacitive pressure sensing technique detects changes in capacitance due to the deformation/deflection of a pressure sensitive mechanical element that alters the separation gap of the capacitor. Due to advancement in state‐of‐the‐art fabrication technologies, the performance and properties of capacitive pressure sensors are enhanced. In this review paper, recent progress in flexible capacitive pressure sensing techniques in terms of design, materials, and fabrication strategies is reported. The mechanics and fabrication steps of paper‐based low‐cost MEMS/flexible devices are also broadly reported. Lastly, the applications of flexible capacitive pressure sensors, challenges, and future perspectives are discussed.

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