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Flexible and Stretchable Microwave Electronics: Past, Present, and Future Perspective
Author(s) -
Zhang Huilong,
Lan Yu,
Qiu Shuoyang,
Min Seunghwan,
Jang Hokyung,
Park Jeongpil,
Gong Shaoqin,
Ma Zhenqiang
Publication year - 2021
Publication title -
advanced materials technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.184
H-Index - 42
ISSN - 2365-709X
DOI - 10.1002/admt.202000759
Subject(s) - electronics , microwave , stretchable electronics , flexible electronics , vacuum tube , microwave engineering , electrical engineering , transistor , nanotechnology , engineering , materials science , telecommunications , voltage
Microwave electronics have evolved from bulky waveguide and vacuum tube‐based format to smaller and lighter board‐based electronics, and then to the highly miniaturized, chip‐based solid‐state form. Spurred by the advent of high‐performance flexible inorganic single‐crystalline semiconductors, a new opportunity of technology evolution from rigid microwave electronics to flexible and/or stretchable microwave electronics has emerged. The new forms of microwave electronics are expected to provide novel functions to be achieved with advanced materials, device, and system design considerations and innovative fabrication methods. Over the last years, some microwave components, modules, and systems with operation frequency greater than or equal to 1 GHz in the flexible/stretchable form factors are demonstrated. These demonstrations have alluded to the prospects of the new stage of microwave electronics evolution. Herein, a comprehensive review of the microwave/flexible microwave electronics that are demonstrated up to date is provided. An introduction to the need of flexible/stretchable microwave electronics emphasizes the motivation and potential influences of this new growing field. This review also highlights important developments in transistors, diodes, various passives, antennas, circuits, and system demonstrations, all in flexible or stretchable forms. Finally, an outlook for specific technical gaps at both the fundamental and applications levels is presented.