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Soft Electronics: Hybrid 3D Printing All‐in‐One Heterogenous Rigidity Assemblies for Soft Electronics (Adv. Mater. Technol. 12/2019)
Author(s) -
Lin Rongzan,
Li Yuanlong,
Mao Xinxin,
Zhou Wanting,
Liu Ran
Publication year - 2019
Publication title -
advanced materials technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.184
H-Index - 42
ISSN - 2365-709X
DOI - 10.1002/admt.201970065
Subject(s) - rigidity (electromagnetism) , flexible electronics , electronics , materials science , flexibility (engineering) , structural rigidity , flexible display , nanotechnology , composite material , structural engineering , electrical engineering , engineering , mathematics , thin film transistor , statistics , layer (electronics)
In article number 1900614, Ran Liu and co‐workers propose a flexible electronic device composed of different modulus materials stretched on human skin, during which its contour of wave line indicates its non‐uniform deformation. In the heterogenous rigidity assemblies, the rigid components can be easily assembled on the flexible substrate to achieve the combination of rigidity and flexibility of the flexible electronics.