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Shapeable Materials: Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics (Adv. Mater. Technol. 4/2019)
Author(s) -
Karnaushenko Daniil,
Kang Tong,
Schmidt Oliver G.
Publication year - 2019
Publication title -
advanced materials technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.184
H-Index - 42
ISSN - 2365-709X
DOI - 10.1002/admt.201970023
Subject(s) - microelectronics , nanotechnology , mesoscale meteorology , scalability , electronics , materials science , computer science , engineering , electrical engineering , physics , database , meteorology
Rapid, large scale manufacture of efficient 3D devices is just one of many possibilities stemming from the concept of self‐assembled mesoscale architectures, as reviewed by Daniil Karnaushenko, Tong Kang and Oliver G. Schmidt, which promise improved scalability in construction and packaging. In article number 1800692 , the various technologies facilitating the self‐assembly of 3D structures are analyzed, as well as the numerous microelectronic components and novel biomedical appliances that can be created using such techniques.