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Semipermanent Copper Nanowire Network with an Oxidation‐Proof Encapsulation Layer
Author(s) -
Hong Insic,
Roh Yeonwook,
Koh JeSung,
Na Seonyeob,
Kim Taewi,
Lee Eunhan,
An Hyeongi,
Kwon Jinhyeong,
Yeo Junyeob,
Hong Sukjoon,
Lee KyuTae,
Kang Daeshik,
Ko Seung Hwan,
Han Seungyong
Publication year - 2019
Publication title -
advanced materials technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.184
H-Index - 42
ISSN - 2365-709X
DOI - 10.1002/admt.201800422
Subject(s) - nanowire , copper , encapsulation (networking) , materials science , nanotechnology , polyimide , penetration (warfare) , moisture , chemical engineering , composite material , layer (electronics) , metallurgy , computer science , computer network , operations research , engineering
Copper nanowires (Cu NWs) have gained attention as an alternative to noble metal nanowires due to their affordable price, but their susceptibility to rapid oxidization in ambient conditions has remained a critical limitation for their practical usage. Many studies have been conducted to address this disadvantage but have been successful only in terms of oxidation prevention at certain temperatures, leaving the matter of oxidation at high temperatures unresolved. In this article, a simple encapsulation structure made of a polyimide and SiOx thin film is presented that effectively prevents the penetration of oxygen and moisture into the Cu NW network. This structure, furthermore, boasts excellent stability at high temperature (≈350 °C) and in underwater, acidic chemical, and abrasive conditions.