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Parallel Process 3D Metal Microprinting
Author(s) -
Lin YenPo,
Zhang Yong,
Yu MinFeng
Publication year - 2019
Publication title -
advanced materials technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.184
H-Index - 42
ISSN - 2365-709X
DOI - 10.1002/admt.201800393
Subject(s) - 3d printing , microscale chemistry , electronics , process (computing) , fabrication , nanotechnology , materials science , agile manufacturing , nanoscopic scale , computer science , digital manufacturing , manufacturing engineering , agile software development , engineering , electrical engineering , metallurgy , medicine , mathematics education , mathematics , alternative medicine , pathology , operating system , software engineering
3D printing, as an additive manufacturing technology, enables agile and free‐form fabrication of complex 3D structures relevant to industrial application. However, the 3D structure forming mechanisms in existing 3D printing technologies hinder and even prevent the manufacturing of ultra‐precision 3D metal parts, let alone parallel process manufacturing. A generic 3D electrochemical microprinting technology that allowed the “printing” of ultrahigh density, ultrahigh aspect ratio, and electronics quality 3D copper structures with microscale and even nanoscale precision in an ambient environment is developed here. Further on, the feedback‐controlled and self‐regulated “printing” mechanism was demonstrated to be capable of realizing parallel process 3D “printing” of an array of identical copper microstructures simultaneously, promising large‐scale 3D printing–based production of precision metal structures for broad applications in 3D integration of electronics and sensor systems.