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3D Printing: Fabrication of Thermally Stable Silver–Organic Complex (TS‐SOC) Based Conductible Filament Materials for 3D Printing (Adv. Mater. Technol. 9/2017)
Author(s) -
Kim Tae Yun,
Kim Sang Il,
Park JongJin
Publication year - 2017
Publication title -
advanced materials technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.184
H-Index - 42
ISSN - 2365-709X
DOI - 10.1002/admt.201770040
Subject(s) - 3d printing , materials science , electrical conductor , extrusion , fabrication , protein filament , fused filament fabrication , nanotechnology , screen printing , composite material , medicine , alternative medicine , pathology
In article number 1700079 , Jong‐Jin Park and co‐workers report thermally stable and electrical conductive filaments for 3D printing. Minimizing the contents of conductive fillers is achieved by forming silver‐organic complex (SOC). Also, the construction of cage structure makes the filament more durable even at high temperature like under extrusion and 3D printing. It is the first demonstration of thermally stable (TS)‐SOC based filaments mechanism and manufacturing process. It reveals the potential to develop the conductive 3D printing for easy customizing the parts in the electronics manufacturing industry.