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Metallic Nanonetworks: A Practical ITO Replacement Strategy: Sputtering‐Free Processing of a Metallic Nanonetwork (Adv. Mater. Technol. 8/2017)
Author(s) -
Xian Zhike,
Han Bing,
Li Songru,
Yang Chaobin,
Wu Sujuan,
Lu Xubing,
Gao Xingsen,
Zeng Min,
Wang Qianming,
Bai Pengfei,
Naughton Michael J.,
Zhou Guofu,
Liu JunMing,
Kempa Krzysztof,
Gao Jinwei
Publication year - 2017
Publication title -
advanced materials technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.184
H-Index - 42
ISSN - 2365-709X
DOI - 10.1002/admt.201770036
Subject(s) - indium tin oxide , sputtering , materials science , evaporation , metal , tin , optoelectronics , nanotechnology , metallurgy , thin film , physics , thermodynamics
In article number 1700061 , Pengfei Bai, Krzysztof Kempa, Jinwei Gao, and co‐workers present a high performance flexible metallic crack‐nanonetwork (with the best figure of merit ≈20 000 at T ≈ 86.4% and R s ≈ 0.13 Ω sq −1 ) by employing a sputtering/evaporation‐free, solution based process. This network outperforms the current industry standard, indium tin oxide (ITO), in performance and cost. In particular, the processing is fully compatible with R2R processing. It is therefore a viable, practical ITO replacement.