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Decal Electronics: Printable Packaged with 3D Printing High‐Performance Flexible CMOS Electronic Systems
Author(s) -
Sevilla Galo A. Torres,
Cordero Marlon D.,
Nassar Joanna M.,
Hanna Amir N.,
Kutbee Arwa T.,
Arevalo Arpys,
Hussain Muhammad M.
Publication year - 2017
Publication title -
advanced materials technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.184
H-Index - 42
ISSN - 2365-709X
DOI - 10.1002/admt.201600175
Subject(s) - electronics , printed electronics , computer science , service (business) , world wide web , manufacturing engineering , electrical engineering , engineering , economy , economics
High‐performance complementary metal oxide semiconductor electronics are flexed, packaged using 3D printing as decal electronics, and then printed in roll‐to‐roll fashion for highly manufacturable printed flexible high‐performance electronic systems.