Premium
Optimizing the Magnetocuring of Epoxy Resins via Electromagnetic Additives
Author(s) -
Chaudhary Richa,
Chaudhary Varun,
Suda Yoshiyuki,
Ramanujan Raju V.,
Steele Terry W. J.
Publication year - 2021
Publication title -
advanced materials interfaces
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.671
H-Index - 65
ISSN - 2196-7350
DOI - 10.1002/admi.202100881
Subject(s) - materials science , epoxy , composite material , curing (chemistry) , adhesive , thermosetting polymer , overheating (electricity) , composite number , nanocomposite , ferric , oxide , electromagnetic shielding , nanoparticle , nanotechnology , physics , layer (electronics) , quantum mechanics , metallurgy
Abstract Magnetocuring of adhesives refers to the curing of an epoxy + Curie temperature controlled magnetic nanoparticles (CNP) composite using a suitable alternating magnetic field. The controlled heating of the CNP results in remote, wireless curing without resin overheating. However, typical CNP possess only a fraction of the heat output of ferric oxide nanoparticles, quantified as the specific absorption rate (SAR). Previous investigations of epoxy + CNP adhesives revealed a SAR of 5 W.g −1 , which is 10–100× less than that of ferric oxides. Here, it is demonstrated that SAR can be improved to up to 60 W.g −1 by tuning CNP composition and by the addition of carbon allotropes (CA) within the resin. Heat generation and dissipation can be also regulated by electromagnetic shielding, resin conductivity, and viscosity. Nanocoils and nanotubes of CA result in improved heating profiles of epoxy thermosets. Magnetocured composites achieve activation within 180 s due to the improved SAR and addition of CA. Remarkably, under optimized conditions, a relatively stable one‐pot adhesive was formed by magnetocuring of epoxy + CNP + CA composites without a hardener.