Premium
Immiscible Alloys: Surpassing Cu–Ta Miscibility Barriers Using a High‐Current Pulsed Arc (Adv. Mater. Interfaces 21/2020)
Author(s) -
MendozaPérez Rafael,
Bahrami Amin,
CalderónOlvera Roxana M.,
RomeroIbarra Josué E.,
ÁlvarezZauco Edgar,
Huerta Lázaro,
Muhl Stephen
Publication year - 2020
Publication title -
advanced materials interfaces
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.671
H-Index - 65
ISSN - 2196-7350
DOI - 10.1002/admi.202070119
Subject(s) - miscibility , materials science , arc (geometry) , arc melting , current (fluid) , spinodal decomposition , chemical engineering , analytical chemistry (journal) , nanotechnology , thermodynamics , metallurgy , composite material , microstructure , phase (matter) , organic chemistry , polymer , mechanical engineering , physics , chemistry , engineering
The instant at which a high‐current pulsed arc evaporates Cu and Ta wires is illustrated. This method creates interesting oxygen‐free Cu–Ta powder having high‐temperature stability, high oxidation temperature, and single‐crystals showing compatible evidence of exceptional miscibility. More details can be found in article number 2000921 by Rafael Mendoza‐Pérez, Amin Bahrami, and co‐workers.