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Void‐Free Layered Polymeric Architectures via Capillary‐Action of Nanoporous Films
Author(s) -
Lee Jeonyoon,
Kessler Seth S.,
Wardle Brian L.
Publication year - 2020
Publication title -
advanced materials interfaces
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.671
H-Index - 65
ISSN - 2196-7350
DOI - 10.1002/admi.201901427
Subject(s) - materials science , nanoporous , capillary action , composite material , nanomaterials , void (composites) , curing (chemistry) , adhesive , carbon nanotube , polymer , capillary pressure , mold , nanoscopic scale , nanotechnology , porosity , porous medium , layer (electronics)
Here, a nanomaterial with morphology‐controlled nanoscale capillaries is utilized to overcome manufacturing challenges in layered polymeric architectures. It is demonstrated that the capillary pressure from a nanoporous film replaces the need for applied pressure to manufacture void‐free layered polymeric architectures. Manufacturing of aerospace‐grade advanced carbon fiber composites is performed for the first time without utilizing pressure from an autoclave. Combined with a conductive curing approach, this work allows advanced composites to be manufactured without costly oven or pressure vessel infrastructure. The nanomaterial‐enabled capillary pressure is quantified as 50% greater than typical pressures used in such processing, and is anticipated to overcome the limitations imposed by the requirement of high applied pressure in many other applications such as adhesive joining of various bulk materials including metals, press forming, and closed‐mold infusion processing of layered composites and polymers.