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Inhibition Role of Trace Metal Ion Additives on Zinc Dendrites during Plating and Striping Processes
Author(s) -
Chang Ge,
Liu Shijun,
Fu Yanan,
Hao Xin,
Jin Wei,
Ji Xiaobo,
Hu Jiugang
Publication year - 2019
Publication title -
advanced materials interfaces
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.671
H-Index - 65
ISSN - 2196-7350
DOI - 10.1002/admi.201901358
Subject(s) - zinc , materials science , nickel , copper , ion , metal , metal ions in aqueous solution , inorganic chemistry , metallurgy , chemistry , organic chemistry
Dendritic inhibition is crucial for the cycle and reversibility of zinc‐based batteries. In this work, the trace metal ions including lead, copper, and nickel are used as additives to inhibit the growth of zinc dendrites. The interfacial evolution behaviors of zinc deposits during plating and striping processes are in situ observed by synchrotron radiation X‐ray imaging technique. The addition of lead and nickel ions induces a polarization role for zinc reduction, whereas copper ions present a depolarization role. After adding trace lead or nickel ions, zinc deposits become smoother and dendrites are effectively suppressed because of the homogenous deposition sites induced by co‐deposition of lead or nickel. Due to the depolarization role of copper ions, a large number of bubbles generate on the substrate and the loose zinc dendrites adhere on the bubble surface. In addition, the zinc deposits in the presence of trace lead ions present a more homogeneous stripping behavior. These results are helpful for understanding the inhibition role of metal ions additives on zinc dendrites and potentially improve the reversibility of zinc‐based batteries.