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Particle Cross‐Linking: Thin, Porous, and Conductive Networks of Metal Nanoparticles through Electrochemical Welding on a Liquid Metal Template (Adv. Mater. Interfaces 19/2018)
Author(s) -
Tang Jianbo,
Zhao Xi,
Li Jing,
Liu Jing
Publication year - 2018
Publication title -
advanced materials interfaces
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.671
H-Index - 65
ISSN - 2196-7350
DOI - 10.1002/admi.201870092
Subject(s) - materials science , porosity , nanoparticle , electrochemistry , particle (ecology) , welding , copper , metal , nanotechnology , chemical engineering , composite material , metallurgy , electrode , chemistry , oceanography , geology , engineering
In article number 1800406 , Jianbo Tang, Jing Liu and co‐workers propose a liquid‐metal‐enabled room‐temperature particle cross‐linking method which is able to “weld” discrete copper nanoparticles into thin, continuous yet porous networks through interfacial electrochemical processes. The authors also demonstrate remarkable mechanical and electrical properties of the materials caused by network formation.