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3D Printings: Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers (Adv. Mater. Interfaces 8/2018)
Author(s) -
Farraj Yousef,
Layani Michael,
Yaverboim Avi,
Magdassi Shlomo
Publication year - 2018
Publication title -
advanced materials interfaces
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.671
H-Index - 65
ISSN - 2196-7350
DOI - 10.1002/admi.201870038
Subject(s) - copper , materials science , conductivity , inkwell , copper plating , polymer , electrical resistivity and conductivity , electroless plating , plating (geology) , decomposition , 3d printed , chemical engineering , metallurgy , composite material , organic chemistry , biomedical engineering , chemistry , electrical engineering , layer (electronics) , electroplating , medicine , engineering , geophysics , geology
Printed electrical circuit with conductivity higher than 70% of bulk copper is obtained. Self‐reducible copper complex ink is used as a catalyst for electroless copper plating. The ink is printed on 2D and 3D substrates followed by short plasma treatment to induce its decomposition and render it catalytically active. This is reported by Shlomo Magdassi and co‐workers in article number 1701285 .