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Flexible Electronics: A General Surface Swelling‐Induced Electroless Deposition Strategy for Fast Fabrication of Copper Circuits on Various Polymer Substrates (Adv. Mater. Interfaces 14/2017)
Author(s) -
Sun Xueyan,
Zhang Lijing,
Tao Shengyang,
Yu Yongxian,
Li Sijie,
Wang Han,
Qiu Jieshan
Publication year - 2017
Publication title -
advanced materials interfaces
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.671
H-Index - 65
ISSN - 2196-7350
DOI - 10.1002/admi.201770067
Subject(s) - fabrication , materials science , electroless deposition , copper , swelling , polymer , nanotechnology , electronics , deposition (geology) , electrical conductor , electronic circuit , flexible electronics , composite material , metallurgy , electrical engineering , engineering , medicine , paleontology , alternative medicine , pathology , sediment , biology
Professor Shengyang Tao and his research group at Dalian University of Technology have succeeded in implementing a simple yet efficient surface swelling‐induced strategy for the fabrication of flexible cirxuits. A writing and electroless deposition method is combined to configure conductive copper patterns on the surface of different polymers in article number 1700052 .