Flexible Electronics: A General Surface Swelling‐Induced Electroless Deposition Strategy for Fast Fabrication of Copper Circuits on Various Polymer Substrates (Adv. Mater. Interfaces 14/2017) | Zendy

Sun Xueyan | Zendy; Zhang Lijing | Zendy; Tao Shengyang | Zendy; Yu Yongxian | Zendy; Li Sijie | Zendy; Wang Han | Zendy; Qiu Jieshan | Zendy

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Flexible Electronics: A General Surface Swelling‐Induced Electroless Deposition Strategy for Fast Fabrication of Copper Circuits on Various Polymer Substrates (Adv. Mater. Interfaces 14/2017)

Author(s) -

Sun Xueyan,

Zhang Lijing,

Tao Shengyang,

Yu Yongxian,

Li Sijie,

Wang Han,

Qiu Jieshan

Publication year - 2017

Publication title -

advanced materials interfaces

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 1.671

H-Index - 65

ISSN - 2196-7350

DOI - 10.1002/admi.201770067

Subject(s) - fabrication , materials science , electroless deposition , copper , swelling , polymer , nanotechnology , electronics , deposition (geology) , electrical conductor , electronic circuit , flexible electronics , composite material , metallurgy , electrical engineering , engineering , medicine , paleontology , alternative medicine , pathology , sediment , biology

Professor Shengyang Tao and his research group at Dalian University of Technology have succeeded in implementing a simple yet efficient surface swelling‐induced strategy for the fabrication of flexible cirxuits. A writing and electroless deposition method is combined to configure conductive copper patterns on the surface of different polymers in article number 1700052 .

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