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Localized Instabilities of Liquid Metal Films via In‐Plane Recapillarity
Author(s) -
Khan Mohammad Rashed,
Bell John,
Dickey Michael D.
Publication year - 2016
Publication title -
advanced materials interfaces
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.671
H-Index - 65
ISSN - 2196-7350
DOI - 10.1002/admi.201600546
Subject(s) - materials science , sketch , eutectic system , oxide , indium tin oxide , nanotechnology , liquid metal , metal , alloy , computer science , thin film , metallurgy , algorithm
This paper describes a simple method to create patterns in thin films of a liquid metal alloy (eutectic gallium indium) using localized electrochemical reduction of the native oxide on the liquid metal surface. This patterning method is similar in spirit to the Etch‐a‐Sketch toy, but uses capillary withdrawal rather than physical scribing to remove material.