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Printed Electronics: Printing a Self‐Reducing Copper Precursor on 2D and 3D Objects to Yield Copper Patterns with 50% Copper's Bulk Conductivity (Adv. Mater. Interfaces 3/2015)
Author(s) -
Rosen Yitzchak,
Grouchko Michael,
Magdassi Shlomo
Publication year - 2015
Publication title -
advanced materials interfaces
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.671
H-Index - 65
ISSN - 2196-7350
DOI - 10.1002/admi.201570014
Subject(s) - copper , materials science , printed electronics , substrate (aquarium) , conductivity , acceptor , electrical resistivity and conductivity , thermal decomposition , yield (engineering) , decomposition , formate , inkwell , metallurgy , chemical engineering , composite material , organic chemistry , chemistry , catalysis , electrical engineering , engineering , oceanography , physics , condensed matter physics , geology
A new ink containing a self‐reducing copper precursor is printed on a donor substrate, and upon its decomposition the metal is transferred to an acceptor substrate. This new process, reactive transfer printing (RTP), is demonstrated in article 1400448 by S. Magdassi and co‐workers, using copper formate as the precursor, forming a copper pattern with excellent conductivity (50% bulk copper). The illustration presents a printed blue donor pattern before decomposition and the obtained copper pattern after thermal decomposition.