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Printing a Self‐Reducing Copper Precursor on 2D and 3D Objects to Yield Copper Patterns with 50% Copper's Bulk Conductivity
Author(s) -
Rosen Yitzchak,
Grouchko Michael,
Magdassi Shlomo
Publication year - 2015
Publication title -
advanced materials interfaces
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.671
H-Index - 65
ISSN - 2196-7350
DOI - 10.1002/admi.201500515
Subject(s) - copper , materials science , conductivity , yield (engineering) , metallurgy , electrical resistivity and conductivity , chemistry , electrical engineering , engineering
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