Metal–Organic Frameworks: Face‐to‐Face Growth of Wafer‐Scale 2D Semiconducting MOF Films on Dielectric Substrates (Adv. Mater. 13/2021) | Zendy

Liu Youxing | Zendy; Wei Yanan | Zendy; Liu Minghui | Zendy; Bai Yichao | Zendy; Wang Xinyu | Zendy; Shang Shengcong | Zendy; Du Changsheng | Zendy; Gao Wenqiang | Zendy; Chen Jianyi | Zendy; Liu Yunqi | Zendy

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Metal–Organic Frameworks: Face‐to‐Face Growth of Wafer‐Scale 2D Semiconducting MOF Films on Dielectric Substrates (Adv. Mater. 13/2021)

Author(s) -

Liu Youxing,

Wei Yanan,

Liu Minghui,

Bai Yichao,

Wang Xinyu,

Shang Shengcong,

Du Changsheng,

Gao Wenqiang,

Chen Jianyi,

Liu Yunqi

Publication year - 2021

Publication title -

advanced materials

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 10.707

H-Index - 527

eISSN - 1521-4095

pISSN - 0935-9648

DOI - 10.1002/adma.202170095

Subject(s) - materials science , dielectric , wafer , microporous material , face (sociological concept) , nanotechnology , electrical conductor , optoelectronics , composite material , social science , sociology

2D metal–organic framework (MOF) films are recognized as a promising candidate for applications in electronics. In article number 2007741, Jianyi Chen, Yunqi Liu, and co‐workers develop a face‐to‐face confinement growth method to obtain high‐quality, conductive Cu 2 (TCPP) MOF films directly on various dielectric substrates. The strategy is achieved by pumping Cu 2+ and TCPP cyclically into a micropore interface to produce this growth.

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