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Metal–Organic Frameworks: Face‐to‐Face Growth of Wafer‐Scale 2D Semiconducting MOF Films on Dielectric Substrates (Adv. Mater. 13/2021)
Author(s) -
Liu Youxing,
Wei Yanan,
Liu Minghui,
Bai Yichao,
Wang Xinyu,
Shang Shengcong,
Du Changsheng,
Gao Wenqiang,
Chen Jianyi,
Liu Yunqi
Publication year - 2021
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.202170095
Subject(s) - materials science , dielectric , wafer , microporous material , face (sociological concept) , nanotechnology , electrical conductor , optoelectronics , composite material , social science , sociology
2D metal–organic framework (MOF) films are recognized as a promising candidate for applications in electronics. In article number 2007741, Jianyi Chen, Yunqi Liu, and co‐workers develop a face‐to‐face confinement growth method to obtain high‐quality, conductive Cu 2 (TCPP) MOF films directly on various dielectric substrates. The strategy is achieved by pumping Cu 2+ and TCPP cyclically into a micropore interface to produce this growth.