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Anode Materials: Stabilization of Sn Anode through Structural Reconstruction of a Cu–Sn Intermetallic Coating Layer (Adv. Mater. 42/2020)
Author(s) -
Wang Guanzhi,
Aubin Megan,
Mehta Abhishek,
Tian Huajun,
Chang Jinfa,
Kushima Akihiro,
Sohn Yongho,
Yang Yang
Publication year - 2020
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.202070319
Subject(s) - anode , intermetallic , materials science , coating , layer (electronics) , electrochemistry , composite material , internal stress , lithium (medication) , metallurgy , electrode , alloy , chemistry , medicine , endocrinology
The mechanical integrity and electrochemical cyclability of a Sn anode for next‐generation lithium‐ion batteries are significantly improved by a surface Cu–Sn intermetallic coating layer (ICL) through a structural reconstruction mechanism, which is presented by Yang Yang and co‐workers in article number 2003684. The Cu–Sn ICL provides a regulatable and appropriate distribution of Cu to buffer the volume change of the Sn anode, mitigating the internal stress and suppressing mechanical degradation.

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