Nanoscale Dewetting: Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing (Adv. Mater. 21/2020) | Zendy

Lee Ju Seung | Zendy; Kang Seung Ji | Zendy; Shin Joo Hwan | Zendy; Shin Yiel Jae | Zendy; Lee Byunghoon | Zendy; Koo JaMyeong | Zendy; Kim Taeil | Zendy

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Nanoscale Dewetting: Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing (Adv. Mater. 21/2020)

Author(s) -

Lee Ju Seung,

Kang Seung Ji,

Shin Joo Hwan,

Shin Yiel Jae,

Lee Byunghoon,

Koo JaMyeong,

Kim Taeil

Publication year - 2020

Publication title -

advanced materials

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 10.707

H-Index - 527

eISSN - 1521-4095

pISSN - 0935-9648

DOI - 10.1002/adma.202070161

Subject(s) - dewetting , microelectronics , materials science , interconnection , nanoscopic scale , nanotechnology , transfer printing , adhesive , electronics , optoelectronics , composite material , thin film , electrical engineering , computer science , telecommunications , engineering , layer (electronics)

In article number 1908422, Tae‐il Kim and co‐workers introduce a facile electrical interconnection method driven by selective dewetting of polymer adhesive, which is applicable to a deterministic microelectronics assembly for flexible electronics. Controlled dewetting of the coated polymeric adhesive is triggered on specific electrode regions, forming vertical interconnection of the microelectronics. Especially, thousands of 30 μm × 60 μm‐scale micro LEDs are demonstrated.

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