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Nanoscale Dewetting: Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing (Adv. Mater. 21/2020)
Author(s) -
Lee Ju Seung,
Kang Seung Ji,
Shin Joo Hwan,
Shin Yiel Jae,
Lee Byunghoon,
Koo JaMyeong,
Kim Taeil
Publication year - 2020
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.202070161
Subject(s) - dewetting , microelectronics , materials science , interconnection , nanoscopic scale , nanotechnology , transfer printing , adhesive , electronics , optoelectronics , composite material , thin film , electrical engineering , computer science , telecommunications , engineering , layer (electronics)
In article number 1908422, Tae‐il Kim and co‐workers introduce a facile electrical interconnection method driven by selective dewetting of polymer adhesive, which is applicable to a deterministic microelectronics assembly for flexible electronics. Controlled dewetting of the coated polymeric adhesive is triggered on specific electrode regions, forming vertical interconnection of the microelectronics. Especially, thousands of 30 μm × 60 μm‐scale micro LEDs are demonstrated.