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Flexible Temperature‐Invariant Polymer Dielectrics with Large Bandgap
Author(s) -
Wu Chao,
Deshmukh Ajinkya A.,
Li Zongze,
Chen Lihua,
Alamri Abdullah,
Wang Yifei,
Ramprasad Rampi,
Sotzing Gregory A.,
Cao Yang
Publication year - 2020
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.202000499
Subject(s) - materials science , dielectric , optoelectronics , polymer , band gap , polyolefin , electronics , flexible electronics , engineering physics , nanotechnology , composite material , electrical engineering , engineering , layer (electronics)
Flexible dielectrics operable under simultaneous electric and thermal extremes are critical to advanced electronics for ultrahigh densities and/or harsh conditions. However, conventional high‐performance polymer dielectrics generally have conjugated aromatic backbones, leading to limited bandgaps and hence high conduction loss and poor energy densities, especially at elevated temperatures. A polyoxafluoronorbornene is reported, which has a key design feature in that it is a polyolefin consisting of repeating units of fairly rigid fused bicyclic structures and alkenes separated by freely rotating single bonds, endowing it with a large bandgap of ≈5 eV and flexibility, while being temperature‐invariantly stable over −160 to 160 °C. At 150 °C, the polyoxafluoronorbornene exhibits an electrical conductivity two orders of magnitude lower than the best commercial high‐temperature polymers, and features an unprecedented discharged energy density of 5.7 J cm −3 far outperforming the best reported flexible dielectrics. The design strategy uncovered in this work reveals a hitherto unexplored space for the design of scalable and efficient polymer dielectrics for electrical power and electronic systems under concurrent harsh electrical and thermal conditions.