3D Assembly: Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving, and Buckling Approaches (Adv. Mater. 36/2019) | Zendy

Cheng Xu | Zendy; Zhang Yihui | Zendy

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3D Assembly: Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving, and Buckling Approaches (Adv. Mater. 36/2019)

Author(s) -

Cheng Xu,

Zhang Yihui

Publication year - 2019

Publication title -

advanced materials

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 10.707

H-Index - 527

eISSN - 1521-4095

pISSN - 0935-9648

DOI - 10.1002/adma.201970254

Subject(s) - materials science , nanoscopic scale , nanotechnology , buckling , microelectromechanical systems , nanostructure , folding (dsp implementation) , electronics , mechanical engineering , composite material , engineering , electrical engineering

In article number 1901895, Yihui Zhang and Xu Cheng discuss the latest progress and new perspectives of micro‐/nanoscale 3D assembly, highlighting the various methods, through rolling, folding, curving, and buckling assembly. Owing to their broad‐ranging applicability to different material systems, the resulting 3D micro‐/nanostructures have compelling applications in widespread areas, from electronics/optoelectronics, and microelectromechanical systems (MEMS), to medical devices and cell scaffolds.

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