Premium
3D Assembly: Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving, and Buckling Approaches (Adv. Mater. 36/2019)
Author(s) -
Cheng Xu,
Zhang Yihui
Publication year - 2019
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201970254
Subject(s) - materials science , nanoscopic scale , nanotechnology , buckling , microelectromechanical systems , nanostructure , folding (dsp implementation) , electronics , mechanical engineering , composite material , engineering , electrical engineering
In article number 1901895, Yihui Zhang and Xu Cheng discuss the latest progress and new perspectives of micro‐/nanoscale 3D assembly, highlighting the various methods, through rolling, folding, curving, and buckling assembly. Owing to their broad‐ranging applicability to different material systems, the resulting 3D micro‐/nanostructures have compelling applications in widespread areas, from electronics/optoelectronics, and microelectromechanical systems (MEMS), to medical devices and cell scaffolds.