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Electromagnetic Shielding of Monolayer MXene Assemblies
Author(s) -
Yun Taeyeong,
Kim Hyerim,
Iqbal Aamir,
Cho Yong Soo,
Lee Gang San,
Kim MyungKi,
Kim Seon Joon,
Kim Daesin,
Gogotsi Yury,
Kim Sang Ouk,
Koo Chong Min
Publication year - 2020
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201906769
Subject(s) - electromagnetic shielding , materials science , monolayer , miniaturization , electromagnetic interference , emi , optoelectronics , electromagnetic radiation , reflection (computer programming) , electronics , absorption (acoustics) , optics , nanotechnology , composite material , electrical engineering , telecommunications , computer science , physics , engineering , programming language
Miniaturization of electronics demands electromagnetic interference (EMI) shielding of nanoscale dimension. The authors report a systematic exploration of EMI shielding behavior of 2D Ti 3 C 2 T x MXene assembled films over a broad range of film thicknesses, monolayer by monolayer. Theoretical models are used to explain the shielding mechanism below skin depth, where multiple reflection becomes significant, along with the surface reflection and bulk absorption of electromagnetic radiation. While a monolayer assembled film offers ≈20% shielding of electromagnetic waves, a 24‐layer film of ≈55 nm thickness demonstrates 99% shielding (20 dB), revealing an extraordinarily large absolute shielding effectiveness (3.89 × 10 6 dB cm 2 g −1 ). This remarkable performance of nanometer‐thin solution processable MXene proposes a paradigm shift in shielding of lightweight, portable, and compact next‐generation electronic devices.