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Promising and Eco‐Friendly Cu 2 X‐Based Thermoelectric Materials: Progress and Applications
Author(s) -
Liu WeiDi,
Yang Lei,
Chen ZhiGang,
Zou Jin
Publication year - 2020
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201905703
Subject(s) - thermoelectric effect , materials science , thermoelectric materials , figure of merit , environmentally friendly , dimensionless quantity , engineering physics , thermal conductivity , nanotechnology , optoelectronics , thermodynamics , composite material , ecology , physics , biology , engineering
Due to the nature of their liquid‐like behavior and high dimensionless figure of merit, Cu 2 X (X = Te, Se, and S)‐based thermoelectric materials have attracted extensive attention. The superionicity and Cu disorder at the high temperature can dramatically affect the electronic structure of Cu 2 X and in turn result in temperature‐dependent carrier‐transport properties. Here, the effective strategies in enhancing the thermoelectric performance of Cu 2 X‐based thermoelectric materials are summarized, in which the proper optimization of carrier concentration and minimization of the lattice thermal conductivity are the main focus. Then, the stabilities, mechanical properties, and module assembly of Cu 2 X‐based thermoelectric materials are investigated. Finally, the future directions for further improving the energy conversion efficiency of Cu 2 X‐based thermoelectric materials are highlighted.