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Application Challenges in Fiber and Textile Electronics
Author(s) -
Wang Lie,
Fu Xuemei,
He Jiqing,
Shi Xiang,
Chen Taiqiang,
Chen Peining,
Wang Bingjie,
Peng Huisheng
Publication year - 2020
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201901971
Subject(s) - electronics , wearable technology , miniaturization , materials science , flexibility (engineering) , stretchable electronics , flexible electronics , wearable computer , textile , fiber , nanotechnology , electrical engineering , computer science , engineering , embedded system , statistics , mathematics , composite material
Modern electronic devices are moving toward miniaturization and integration with an emerging focus on wearable electronics. Due to their close contact with the human body, wearable electronics have new requirements including low weight, small size, and flexibility. Conventional 3D and 2D electronic devices fail to efficiently meet these requirements due to their rigidity and bulkiness. Hence, a new family of 1D fiber‐shaped electronic devices including energy‐harvesting devices, energy‐storage devices, light‐emitting devices, and sensing devices has risen to the challenge due to their small diameter, lightweight, flexibility, and weavability into soft textile electronics. The application challenges faced by fiber and textile electronics from single fiber‐shaped devices to continuously scalable fabrication, to encapsulation and testing, and to application mode exploration, are discussed. The evolutionary trends of fiber and textile electronics are then summarized. Finally, future directions required to boost their commercialization are highlighted.