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Universal Route to Impart Orthogonality to Polymer Semiconductors for Sub‐Micrometer Tandem Electronics
Author(s) -
Park Han Wool,
Choi KeunYeong,
Shin Jihye,
Kang Boseok,
Hwang Haejung,
Choi Shinyoung,
Song Aeran,
Kim Jaehee,
Kweon Hyukmin,
Kim Seunghan,
Chung KwunBum,
Kim BongSoo,
Cho Kilwon,
Kwon SoonKi,
Kim YunHi,
Kang Moon Sung,
Lee Hojin,
Kim Do Hwan
Publication year - 2019
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201901400
Subject(s) - materials science , photolithography , polymer , semiconductor , nanotechnology , fabrication , micrometer , etching (microfabrication) , electronics , optoelectronics , optics , composite material , chemistry , alternative medicine , physics , pathology , layer (electronics) , medicine
A universal method that enables utilization of conventional photolithography for processing a variety of polymer semiconductors is developed. The method relies on imparting chemical and physical orthogonality to a polymer film via formation of a semi‐interpenetrating diphasic polymer network with a bridged polysilsesquioxane structure, which is termed an orthogonal polymer semiconductor gel. The synthesized gel films remain tolerant to various chemical and physical etching processes involved in photolithography, thereby facilitating fabrication of high‐resolution patterns of polymer semiconductors. This method is utilized for fabricating tandem electronics, including pn‐complementary inverter logic devices and pixelated polymer light‐emitting diodes, which require deposition of multiple polymer semiconductors through solution processes. This novel and universal method is expected to significantly influence the development of advanced polymer electronics requiring sub‐micrometer tandem structures.