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Scalable Polymer Nanocomposites with Record High‐Temperature Capacitive Performance Enabled by Rationally Designed Nanostructured Inorganic Fillers
Author(s) -
Li He,
Ai Ding,
Ren Lulu,
Yao Bin,
Han Zhubing,
Shen Zhonghui,
Wang Jianjun,
Chen LongQing,
Wang Qing
Publication year - 2019
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201900875
Subject(s) - materials science , nanocomposite , microelectronics , dielectric , polymer , polymer nanocomposite , composite material , nanowire , nanoparticle , capacitive sensing , nanotechnology , optoelectronics , electrical engineering , engineering
Next‐generation microelectronics and electrical power systems call for high‐energy‐density dielectric polymeric materials that can operate efficiently under elevated temperatures. However, the currently available polymer dielectrics are limited to relatively low working temperatures. Here, the solution‐processable polymer nanocomposites consisting of readily prepared Al 2 O 3 fillers with systematically varied morphologies including nanoparticles, nanowires, and nanoplates are reported. The field‐dependent electrical conduction of the polymer nanocomposites at elevated temperatures is investigated. A strong dependence of the conduction behavior and breakdown strength of the polymer composites on the filler morphology is revealed experimentally and is further rationalized via computations. The polymer composites containing Al 2 O 3 nanoplates display a record capacitive performance, e.g., a discharged energy density of 3.31 J cm −3 and a charge–discharge efficiency of >90% measured at 450 MV m −1 and 150 °C, significantly outperforming the state‐of‐the‐art dielectric polymers and nanocomposites that are typically prepared via tedious, low‐yield approaches.