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Polymer Dielectrics: A Scalable, High‐Throughput, and Environmentally Benign Approach to Polymer Dielectrics Exhibiting Significantly Improved Capacitive Performance at High Temperatures (Adv. Mater. 49/2018)
Author(s) -
Zhou Yao,
Li Qi,
Dang Bin,
Yang Yang,
Shao Tao,
Li He,
Hu Jun,
Zeng Rong,
He Jinliang,
Wang Qing
Publication year - 2018
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201870378
Subject(s) - materials science , capacitor , dielectric , throughput , chemical vapor deposition , polymer , capacitive sensing , nanoscopic scale , deposition (geology) , layer (electronics) , nanotechnology , extrusion , optoelectronics , thin film , high κ dielectric , chemical engineering , composite material , voltage , electrical engineering , computer science , telecommunications , paleontology , sediment , wireless , biology , engineering
High‐throughput production of high‐temperature capacitor films is realized by Qi Li, Jinliang He, Qing Wang, and co‐workers in article number 1805672 through fast and continuous deposition of a nanoscale thin layer of an insulating barrier using atmospheric‐pressure plasma‐enhanced chemical vapor deposition. This approach should be adaptable to the industrial extrusion method for highly productive manufacturing of capacitor films.

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