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Antisolvent with an Ultrawide Processing Window for the One‐Step Fabrication of Efficient and Large‐Area Perovskite Solar Cells
Author(s) -
Zhao Pengjun,
Kim Byeong Jo,
Ren Xiaodong,
Lee Dong Geon,
Bang Gi Joo,
Jeon Jae Bum,
Kim Won Bin,
Jung Hyun Suk
Publication year - 2018
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201802763
Subject(s) - materials science , perovskite (structure) , spin coating , thin film , photovoltaic system , perovskite solar cell , glovebox , anisole , chemical engineering , fabrication , solar cell , energy conversion efficiency , optoelectronics , nanotechnology , organic chemistry , catalysis , medicine , ecology , chemistry , alternative medicine , pathology , engineering , biology
Photovoltaic technologies based on perovskite absorber materials have led this optoelectronic field into a brand‐new horizon. However, the present antisolvents used in the one‐step spin‐coating method always encounter problems with the very narrow process window. Herein, anisole is introduced into the one‐step spin‐coating method, and the technology is developed to fabricate perovskite thin films with ultrawide processing window with a dimethylformamide (DMF):dimethyl sulfoxide (DMSO) ratio varying from 6:4 to 9:1 in the precursor solution, anisole dripping time ranging from 5 to 25 s, and an antisolvent volume varying from 0.1 to 0.9 mL. Perovskite thin films as large as 100 cm 2 are successfully fabricated using this method. Maximum photoelectric conversion efficiencies of 19.76% for small‐area (0.14 cm 2 ) and 17.39% for large‐area (1.08 cm 2 ) perovskite solar cell devices are obtained. It is also found that there are intermolecular hydrogen‐bonding forces between anisole and DMF/DMSO that play critical roles in the wide process window. These results provide a deeper understanding of the crystallizing procedure of perovskite during the one‐step spin‐coating process.

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