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Biodegradable Electronic Systems in 3D, Heterogeneously Integrated Formats
Author(s) -
Chang JanKai,
Chang HuiPing,
Guo Qinglei,
Koo Jahyun,
Wu ChihI,
Rogers John A.
Publication year - 2018
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201704955
Subject(s) - microsystem , electronics , transfer printing , materials science , nanotechnology , integrated circuit , electronic circuit , layer (electronics) , printed electronics , scope (computer science) , stretchable electronics , computer science , electronic engineering , electrical engineering , engineering , optoelectronics , composite material , programming language
Biodegradable electronic systems represent an emerging class of technology with unique application possibilities, from temporary biomedical implants to “green” consumer gadgets. This paper introduces materials and processing methods for 3D, heterogeneously integrated devices of this type, with various functional examples in sophisticated forms of silicon‐based electronics. Specifically, techniques for performing multilayer assembly by transfer printing and for fabricating layer‐to‐layer vias and interconnects by lithographic procedures serve as routes to biodegradable, 3D integrated circuits composed of functional building blocks formed using specialized approaches or sourced from commercial semiconductor foundries. Demonstration examples range from logic gates and analog circuits that undergo functional transformation by transience to systems that integrate multilayer resistive sensors for in situ, continuous electrical monitoring of the processes of transience. The results significantly expand the scope of engineering options for biodegradable electronics and other types of transient microsystem technologies.