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Printable Transparent Conductive Films for Flexible Electronics
Author(s) -
Li Dongdong,
Lai WenYong,
Zhang YiZhou,
Huang Wei
Publication year - 2018
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201704738
Subject(s) - materials science , printed electronics , electronics , electrical conductor , nanotechnology , transparent conducting film , flexible electronics , indium tin oxide , conductive polymer , inkwell , stretchable electronics , screen printing , transfer printing , roll to roll processing , flexible display , conductive ink , graphene , optoelectronics , thin film transistor , thin film , sheet resistance , polymer , electrical engineering , composite material , layer (electronics) , engineering
Printed electronics are an important enabling technology for the development of low‐cost, large‐area, and flexible optoelectronic devices. Transparent conductive films (TCFs) made from solution‐processable transparent conductive materials, such as metal nanoparticles/nanowires, carbon nanotubes, graphene, and conductive polymers, can simultaneously exhibit high mechanical flexibility, low cost, and better photoelectric properties compared to the commonly used sputtered indium‐tin‐oxide‐based TCFs, and are thus receiving great attention. This Review summarizes recent advances of large‐area flexible TCFs enabled by several roll‐to‐roll‐compatible printed techniques including inkjet printing, screen printing, offset printing, and gravure printing using the emerging transparent conductive materials. The preparation of TCFs including ink formulation, substrate treatment, patterning, and postprocessing, and their potential applications in solar cells, organic light‐emitting diodes, and touch panels are discussed in detail. The rational combination of a variety of printed techniques with emerging transparent conductive materials is believed to extend the opportunities for the development of printed electronics within the realm of flexible electronics and beyond.