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Bottom‐Up Fabrication of Semiconductive Metal–Organic Framework Ultrathin Films
Author(s) -
RubioGiménez Víctor,
Galbiati Marta,
CastellsGil Javier,
AlmoraBarrios Neyvis,
NavarroSánchez José,
EscorciaAriza Garin,
Mattera Michele,
Arnold Thomas,
Rawle Jonathan,
Tatay Sergio,
Coronado Eugenio,
MartíGastaldo Carlos
Publication year - 2018
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201704291
Subject(s) - materials science , crystallinity , electrical conductor , nanotechnology , fabrication , homogeneity (statistics) , electrically conductive , semiconductor , porosity , monolayer , substrate (aquarium) , surface modification , metal organic framework , organic semiconductor , conductive polymer , polymer , chemical engineering , composite material , optoelectronics , organic chemistry , medicine , statistics , alternative medicine , mathematics , oceanography , pathology , adsorption , chemistry , geology , engineering
Though generally considered insulating, recent progress on the discovery of conductive porous metal–organic frameworks (MOFs) offers new opportunities for their integration as electroactive components in electronic devices. Compared to classical semiconductors, these metal–organic hybrids combine the crystallinity of inorganic materials with easier chemical functionalization and processability. Still, future development depends on the ability to produce high‐quality films with fine control over their orientation, crystallinity, homogeneity, and thickness. Here self‐assembled monolayer substrate modification and bottom‐up techniques are used to produce preferentially oriented, ultrathin, conductive films of Cu‐CAT‐1. The approach permits to fabricate and study the electrical response of MOF‐based devices incorporating the thinnest MOF film reported thus far (10 nm thick).