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Characterization of Edge Contact: Atomically Resolved Semiconductor–Metal Lateral Boundary in MoS 2
Author(s) -
Kwon Hyeokshin,
Lee Kiyoung,
Heo Jinseong,
Oh Youngtek,
Lee Hyangsook,
Appalakondaiah Samudrala,
Ko Wonhee,
Kim Hyo Won,
Jung JinWook,
Suh Hwansoo,
Min Hongki,
Jeon Insu,
Hwang Euyheon,
Hwang Sungwoo
Publication year - 2017
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201702931
Subject(s) - materials science , contact resistance , ohmic contact , semiconductor , optoelectronics , scanning tunneling microscope , electrical contacts , scanning electron microscope , characterization (materials science) , nanotechnology , layer (electronics) , composite material
Despite recent efforts for the development of transition‐metal‐dichalcogenide‐based high‐performance thin‐film transistors, device performance has not improved much, mainly because of the high contact resistance at the interface between the 2D semiconductor and the metal electrode. Edge contact has been proposed for the fabrication of a high‐quality electrical contact; however, the complete electronic properties for the contact resistance have not been elucidated in detail. Using the scanning tunneling microscopy/spectroscopy and scanning transmission electron microscopy techniques, the edge contact, as well as the lateral boundary between the 2D semiconducting layer and the metalized interfacial layer, are investigated, and their electronic properties and the energy band profile across the boundary are shown. The results demonstrate a possible mechanism for the formation of an ohmic contact in homojunctions of the transition‐metal dichalcogenides semiconductor–metal layers and suggest a new device scheme utilizing the low‐resistance edge contact.