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Ultrahigh Thermal Conductive yet Superflexible Graphene Films
Author(s) -
Peng Li,
Xu Zhen,
Liu Zheng,
Guo Yan,
Li Peng,
Gao Chao
Publication year - 2017
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201700589
Subject(s) - materials science , graphene , electrical conductor , thermal conductivity , thermal , brittleness , ductility (earth science) , electronics , composite material , optoelectronics , nanotechnology , electrical engineering , creep , physics , engineering , meteorology
Electrical devices generate heat at work. The heat should be transferred away immediately by a thermal manager to keep proper functions, especially for high‐frequency apparatuses. Besides high thermal conductivity ( K ), the thermal manager material requires good foldability for the next generation flexible electronics. Unfortunately, metals have satisfactory ductility but inferior K (≤429 W m −1 K −1 ), and highly thermal‐conductive nonmetallic materials are generally brittle. Therefore, fabricating a foldable macroscopic material with a prominent K is still under challenge. This study solves the problem by folding atomic thin graphene into microfolds. The debris‐free giant graphene sheets endow graphene film (GF) with a high K of 1940 ± 113 W m −1 K −1 . Simultaneously, the microfolds render GF superflexible with a high fracture elongation up to 16%, enabling it more than 6000 cycles of ultimate folding. The large‐area multifunctional GFs can be easily integrated into high‐power flexible devices for highly efficient thermal management.