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In‐Plane Deformation Mechanics for Highly Stretchable Electronics
Author(s) -
Su Yewang,
Ping Xuecheng,
Yu Ki Jun,
Lee Jung Woo,
Fan Jonathan A.,
Wang Bo,
Li Ming,
Li Rui,
Harburg Daniel V.,
Huang YongAn,
Yu Cunjiang,
Mao Shimin,
Shim Jaehoun,
Yang Qinglin,
Lee PeiYin,
Armonas Agne,
Choi KiJoong,
Yang Yichen,
Paik Ungyu,
Chang Tammy,
Dawidczyk Thomas J.,
Huang Yonggang,
Wang Shuodao,
Rogers John A.
Publication year - 2017
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201604989
Subject(s) - materials science , deformation (meteorology) , buckling , composite material , stretchable electronics , plane (geometry) , electronics , nanotechnology , geometry , chemistry , mathematics
Scissoring in thick bars suppresses buckling behavior in serpentine traces that have thicknesses greater than their widths, as detailed in a systematic set of analytical and experimental studies. Scissoring in thick copper traces enables elastic stretchability as large as ≈350%, corresponding to a sixfold improvement over previously reported values for thin geometries (≈60%).