Premium
Flexible Encapsulation: Flexible Lamination Encapsulation (Adv. Mater. 29/2015)
Author(s) -
Park MinHo,
Kim JinYou,
Han TaeHee,
Kim TaeSik,
Kim Hobeom,
Lee TaeWoo
Publication year - 2015
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201570197
Subject(s) - encapsulation (networking) , materials science , bilayer , composite material , nanotechnology , computer science , membrane , computer network , genetics , biology
A novel flexible‐encapsulation method (Flex Lami‐capsulation), which laminates a simple metal foil/rubbery polymer bilayer on flexible devices, is reported on page 4308 by T.‐W. Lee and co‐workers. Flex Lami‐capsulation can be applied to the roll‐to‐roll process for mass production of flexible electronic devices, and overcomes the drawbacks of conventional rigid glass and thin‐film encapsulation methods.
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom