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Self‐Assembled On‐Chip‐Integrated Giant Magneto‐Impedance Sensorics
Author(s) -
Karnaushenko Daniil,
Karnaushenko Dmitriy D.,
Makarov Denys,
Baunack Stefan,
Schäfer Rudolf,
Schmidt Oliver G.
Publication year - 2015
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201503127
Subject(s) - materials science , planar , magneto , chip , electrical impedance , cmos , domain (mathematical analysis) , giant magnetoimpedance , optoelectronics , nanotechnology , magnetic field , electrical engineering , giant magnetoresistance , magnet , computer science , engineering , physics , quantum mechanics , magnetoresistance , mathematical analysis , computer graphics (images) , mathematics
A novel method relying on strain engineering to realize arrays of on‐chip‐integrated giant magneto‐impedance (GMI) sensors equipped with pick‐up coils is put forth. The geometrical transformation of an initially planar layout into a tubular 3D architecture stabilizes favorable azimuthal magnetic domain patterns. This work creates a solid foundation for further development of CMOS compatible GMI sensorics for magnetoencephalography.