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Flexible Lamination Encapsulation
Author(s) -
Park MinHo,
Kim JinYou,
Han TaeHee,
Kim TaeSik,
Kim Hobeom,
Lee TaeWoo
Publication year - 2015
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201501856
Subject(s) - encapsulation (networking) , materials science , nanotechnology , getter , flex , computer science , optoelectronics , computer network , telecommunications
A novel flexible encapsulation method (Flex Lami‐capsulation) is reported, which can be applied in the roll‐to‐roll process for mass production of organic electronic devices. Flex Lami‐capsulation is very simple, fast, and getter‐free, and is as effective as glass encapsulation. Use of this method is feasible in large‐area flexible displays and does not have the drawbacks of conventional encapsulation methods.