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Facile Preparation of High‐Performance Elastically Stretchable Interconnects
Author(s) -
Polywka Andreas,
Jakob Timo,
Stegers Luca,
Riedl Thomas,
Görrn Patrick
Publication year - 2015
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201501461
Subject(s) - materials science , photoresist , electroless deposition , deposition (geology) , nanotechnology , electrode , polymer , ultraviolet , composite material , optoelectronics , metal , metallurgy , paleontology , chemistry , layer (electronics) , sediment , biology
Sites on poly(dimethylsiloxane) are selected by ultraviolet exposure. In a subsequent electroless deposition, solid silver films are created on the selected sites only. In this way, facile vacuum‐free deposition of electrodes from the liquid phase and their photoresist‐ and solvent‐free patterning are realized. The technique enables reliable rigid‐to‐soft interconnects that are reversibly stretchable under arbitrary and changing stretching directions.