Thin Film Thermoelectric Metal–Organic Framework with High Seebeck Coefficient and Low Thermal Conductivity | Zendy

Erickson Kristopher J. | Zendy; Léonard François | Zendy; Stavila Vitalie | Zendy; Foster Michael E. | Zendy; Spataru Catalin D. | Zendy; Jones Reese E. | Zendy; Foley Brian M. | Zendy; Hopkins Patrick E. | Zendy; Allendorf Mark D. | Zendy; Talin A. Alec | Zendy

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Thin Film Thermoelectric Metal–Organic Framework with High Seebeck Coefficient and Low Thermal Conductivity

Author(s) -

Erickson Kristopher J.,

Léonard François,

Stavila Vitalie,

Foster Michael E.,

Spataru Catalin D.,

Jones Reese E.,

Foley Brian M.,

Hopkins Patrick E.,

Allendorf Mark D.,

Talin A. Alec

Publication year - 2015

Publication title -

advanced materials

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 10.707

H-Index - 527

eISSN - 1521-4095

pISSN - 0935-9648

DOI - 10.1002/adma.201501078

Subject(s) - seebeck coefficient , thermoelectric effect , thermoelectric materials , materials science , thermal conductivity , thermoelectric generator , engineering physics , nanotechnology , composite material , thermodynamics , physics

A new thermoelectric material with high Seebeck coefficient and low thermal conductivity is demonstrated based on an electrically conducting metal–organic framework (MOF) using the guest@MOF concept. This demonstration opens a new avenue for the future development of thermoelectric materials.

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