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Deposition of Wafer‐Scale Single‐Component and Binary Nanocrystal Superlattice Thin Films Via Dip‐Coating
Author(s) -
Gaulding E. Ashley,
Diroll Benjamin T.,
Goodwin E. D.,
Vrtis Zachary J.,
Kagan Cherie R.,
Murray Christopher B.
Publication year - 2015
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201405575
Subject(s) - materials science , superlattice , nanocrystal , wafer , deposition (geology) , thin film , coating , component (thermodynamics) , nanotechnology , nanoscopic scale , binary number , scale (ratio) , optoelectronics , paleontology , physics , arithmetic , mathematics , quantum mechanics , sediment , biology , thermodynamics
Single‐component and binary nanocrystal superlattices are assembled over wafer‐scale areas using the dip‐coating method. A series of measurements are performed to confirm superlattice assembly. This study demonstrates the versatility of dip‐coating in depositing a diverse set of nanocrystal materials and superlattice structures, while combining large‐area deposition with nanoscale control.